Entry-Level Custom IC Design Engineer

Job Description

At Boeing, we innovate and collaborate to make the world a better place. From the seabed to outer space, you can contribute to work that matters with a company where diversity, equity and inclusion are shared values. We’re committed to fostering an environment for every teammate that’s welcoming, respectful and inclusive, with great opportunity for professional growth. Find your future with us.

Currently SSED is actively hiring Entry-Level Custom IC Design Engineers. This position will be based out of Tukwila, Washington.

At Boeing, we innovate and collaborate to make the world a better place. From the seabed to outer space, you can contribute to work that matters with a company where diversity, equity and inclusion are shared values. We’re committed to fostering an environment for every teammate that’s welcoming, respectful and inclusive, with great opportunity for professional growth. Find your future with us.

We are Boeing Research & Technology (BR&T): Boeings global research and development team creating and implementing innovative technologies that make the impossible possible and enabling the future of aerospace.  We are engineers and technicians, skilled scientists and bold innovators; Join us and put your passion, determination, and skill to work building the future!   TheFutureIsBuiltHere  ChangeTheWorld

Within BR&T, Boeing’s Solid State Electronics Development organization (SSED) performs microelectronics technology development for aerospace systems.  SSED develops digital, analog, and RF Systems on Chip (SoCs) for radar, navigation, electronic warfare, communications, processing, and other electronic functions. These systems are used on Boeing airborne, terrestrial, and satellite platforms. Designs are implemented with state-of-the-art semiconductor process technologies including CMOS, GaAs, GaN, and SiGe. SSED uses external wafer fabrication services but executes the whole design flow in-house (architecture definition, circuit design, RTL, synthesis, physical layout, verification, packaging and testing).  SSED owns numerous microelectronics projects, funded both by internal Boeing programs and external U.S. Government Science and Technology (S&T) customers. SSED’s large staff of microelectronics engineers conducts research and designs microelectronics hardware in support of these projects.

SSED executes a variety of exciting, technically challenging projects, offering endless opportunities to develop depth and breadth of technical skills.  We offer on-the-job learning opportunities and long-term potential for career growth into both technical leadership and/or management positions and seek curiosity, creativity, innovation, attention to detail, clear communication, and the ability to understand and meet customer needs.

Position Responsibilities:

• Perform full-custom IC design

• Develop standard cells incorporating structured, pitched, or arrayed layout

• Perform custom and standard cell-based floor-planning and hierarchical layout assembly.

• Manage IR drop, RC delay, electro migration, self-heating and coupling capacitance.

• Perform physical verification including DRC, LVS, and ERC

• Perform parasitic extraction and analysis.

• Perform component level layout in advanced technologies (e.g. FinFET).

• Communicate effectively with a cross-functional team, including written and verbal communication of requirements and responsibilities in all platforms

• Utilize industry standard EDA tools from Cadence, Mentor, and Synopsys

• Perform analog and high-power layout techniques

• Exercise and debug the IC verification flow (DRC, LVS, XOR, PEX, etc.)

• Design Mixed-Signal IC macro sub-circuits

• Design specialized circuits for extreme temperatures, harsh radiation environments, ultra-low-power and low-area solutions.

• Document circuit designs for design traceability and testing enablement

• Test and characterize circuits in a laboratory environment

This position requires the ability to obtain a U.S. Security Clearance for which the US Government requires US Citizenship. An interim and/or final U.S. Secret Clearance Post-start is required.

Basic Qualifications (Required Skills/Experience):

• Bachelor’s degree or higher in engineering, computer science, mathematics, physics or chemistry

• Course work, lab exercise work or professional experience in Custom or Analog/Mixed-Signal IC design

• Basic knowledge of standard cell development, including design, layout, analysis, and test

• Familiarity with Electronic Design Automation (EDA) tools and methodologies for Custom or Analog/Mixed-Signal design

• Basic understanding of deep submicron device physics

Preferred Qualifications (Desired Skills/Experience):

• Experience with layout techniques for managing IR drop, RC delay, electro-migration, self-heating and coupling capacitance

• Ability to derive requirements and complying with specifications in circuits and systems

• Basic knowledge of design in Analog, Digital, Mixed-Signal, RF domains

• Familiarity with Product Design Kit (PDK) in a modern state-of-the-art process technology (FinFET or GAA FET)

• Experience with commercial Cadence tools (Virtuoso suite and Spectre simulator products)

• Basic knowledge of Analog/Mixed-Signal circuits in state-of-the-art semiconductor fabrication processes (e.g. 7/10/12/14/16nm FinFET CMOS, 22nm FDSOI CMOS)

• Demonstrated track record as a high-performance team member

• Excellent verbal and written communication ability

• Active security clearance

• Must be able to recognize failure prone circuit and layout structures, have experience in applying DFM best practices, and proactively work with circuit designers to identify the best approach to solving problems

• Proficiency in interpretation of CALIBRE DRC, ERC, LVS, etc. reports.

• Scripting skills in PERL or SKILL are considered a plus, but not required.

Typical Education & Experience:

Entry-Level: Education/experience typically acquired through advanced technical education from an accredited course of study in engineering, computer science, mathematics, physics or chemistry (e.g. Bachelor) or an equivalent combination of technical education and experience. In the USA, ABET accreditation is the preferred, although not required, accreditation standard.

Relocation: This position offers relocation based on candidate eligibility.

Shift: This position is for 1st shift.

Drug Free Workplace: Boeing is a Drug Free Workplace where post offer applicants and employees are subject to testing for marijuana, cocaine, opioids, amphetamines, PCP, and alcohol when criteria is met as outlined in our policies.

Union: This is a union-represented position.

BRTMSA

At Boeing, we strive to deliver a Total Rewards package that will attract, engage and retain the top talent.  Elements of the Total Rewards package include competitive base pay and variable compensation opportunities. The Boeing Company also provides eligible employees with an opportunity to enroll in a variety of benefit programs, generally including health insurance, flexible spending accounts, health savings accounts, retirement savings plans, life and disability insurance programs, and a number of programs that provide for both paid and unpaid time away from work.  The specific programs and options available to any given employee may vary depending on eligibility factors such as geographic location, date of hire, and the applicability of collective bargaining agreements. Please note that the salary information shown below is a general guideline only.  Salaries are based upon candidate experience and qualifications, as well as market and business considerations. 

Summary pay range: Entry-Level: $70,550 – $95,450

Applications for this position will be accepted through: 3/29/2024

Equal Opportunity Employer:

Boeing is an Equal Opportunity Employer. Employment decisions are made without regard to race, color, religion, national origin, gender, sexual orientation, gender identity, age, physical or mental disability, genetic factors, military/veteran status or other characteristics protected by law.