Join a team recognized for leadership, innovation and diversityThe future is what you make it. When you join Honeywell, you become a member of our global team of thinkers, innovators, dreamers and doers who make the things that make the future. That means changing the way we fly, fueling jets in an

IC Radiation Effects Engineer - Recent Grad/Full Time

Honeywell Aerospace • 
Plymouth, Minnesota, United States
Position Type: Permanent
Job Description:
Join a team recognized for leadership, innovation and diversity

The future is what you make it.

 When you join Honeywell, you become a member of our global team of thinkers, innovators, dreamers and doers who make the things that make the future. That means changing the way we fly, fueling jets in an eco-friendly way, keeping buildings smart and safe and even making it possible to breathe on Mars. Working at Honeywell isnt just about developing cool things. Thats why all of our employees enjoy access to dynamic career opportunities across different fields and industries.

Are you ready to help us make the future?

Join theengineering team at Honeywell that designs, verifies, integrates, and testscomplex integrated circuit products that enable systems development for deploymentin space. Honeywells integrated circuit wafer foundry produces parts forsatellites, space probes, defense, and other novel applications.  You will develop radiation-testing solutions andcharacterize wafer process technologies, circuits, test chips and products viaradiation testing and modeling that enable new product developments in supportof the organizations business strategies. You will be responsible for understandingseveral radiation-hardened SOI technologies and methods to achieve andcharacterize radiation hardening of them and the circuits and productsdeveloped with them. You will work closely with world class hardwaredevelopment engineers, circuit design engineers, radiation testing tools &facility and personnel. 

Key Responsibilities

  •  Assist in efforts to develop and fully characterize CMOS Wafer Process Technology and Circuits for radiation hardened applications
  • Develop solutions to enable process control monitor testing and wafer acceptance specifications and criteria that support radiation hardness assurance
  • Provide support to circuit designers for radiation hardening methods, modeling and characterization
  • Conceive and deploy structures and their test methods for technology & circuit development
  • Develop methods, execute and oversee testing, and model behaviors for technology and circuit hardening
  • Characterize radiation effects on devices and circuits (e.g., total ionizing dose, neutron displacement damage, dose rate upset, single event effects)
  • Prepare test hardware, software, test plans, and documentation
MINIMUM QUALIFICATIONS:
  • Degree in Electrical Engineering or Physics
  • Ability and willingness to work on-site at the Honeywell Plymouth, MN facility (zip code 55441)
  • Active, or previously held USG Secret security clearance in good standing, or, no known barriers to achieve a USG Secret security clearance is required
  • Ability and willingness to travel to radiation test facilities in the continental United States to perform on-site radiation testing
  • Ability and willingness to lift up to 40 pounds of radiation testing and characterization equipment
  • Graduatebetween May 2023 - June 2024
  • U.S. citizen required due to compliance with U.S. export control laws and regulations
 
WE VALUE:
  •  Masters degree in electrical engineering or physics
  • Nuclear and quantum-mechanical physics knowledge
  • Ability to pair physics knowledge and integrated circuit [IC] knowledge to understand radiation interactions with ICs, circuit primitive device types (e.g., IC transistors, resistors, etc), and radiation testing equipment and principles of operation
  • In-depth knowledge of transistor device physics
  • Experience and willingness to work in laboratory settings to develop hardware and software for custom testing applications
  • Goodcommunication skills and high proficiency with Microsoft Office suite (Excel,PowerPoint, Word, Teams)
  • Windows and LINUX operating systems knowledge and scripting languages
  • Experience in CMOS technology test chip design for characterization and modeling purposes
  • Experience working in multi-disciplinary teams
  • Knowledge of statistically designed experiments and regression methods for analyses and response surface modeling

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