Join a team recognized for leadership, innovation and diversityThe future is what you make it.
When you join Honeywell, you become a member of our global team of thinkers, innovators, dreamers and doers who make the things that make the future.
Join a team that develops new or modified process formulations, defines processing or handling equipment requirements and specifications, and reviews processing techniques and methods applied in the manufacture, fabrication and evaluation of semiconductors. You will influence the planning and designing of manufacturing engineering processes pertaining to semiconductors, and determine parts and tools needed in order to achieve manufacturing goals according to product specification. You will maximize efficiency by analyzing the layout of equipment, workflow, assembly methods, and work force utilization.
Key Responsibilities- Participate in project teams
- Facilitate issue identification and analysis
- Investigate and resolve technical issues
- Test products & software
- Develop and share knowledge
- Perform administrative duties
U.S. PERSON REQUIREMENTS Due to compliance with U.S. export control laws and regulations, candidate must be a U.S. Person, which is defined as, a U.S. citizen, a U.S. permanent resident, or have protected status in the U.S. under asylum or refugee status.
YOU MUST HAVE- Bachelors degree from an accredited institution in a technical discipline such as the sciences, technology, engineering or mathematics
WE VALUE- Prefer at least 3 years in Chip Assembly and Packaging
- Significant relevant engineering experience
- Ability to multitask
- Team oriented
- Ability to follow directions and make tasks your own
- Quickly and accurately identifies even subtle interrelationships and patterns among a variety of problems and issues.
- Conveys information with clarity and directness, ensuring the message is understood across diverse, global teams.
